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Product【Thermal Management Parts】required

Heat Spreader Carbon Nanotube Thermal Interface Material

Product【Product for Semiconductor Manufacturing Equipment】required

Ceramic Electrostatic Chuck

Product【Metal Products】required

Motor Core Precision Die Parts

Product【Substrate】required

Flip-Chip Package Substrate ~DLL®/DLL3®~ Plastic BGA Substrate Plastic BGA Thin Substrate (Coreless Substrate) 2.3D Package Substrate ~i-THOP®~ Substrate with Optical Waveguides

Product【Leadframe】required

Product【IC Assembly】required

Device Embedded Package ~MCeP®~ Bare Die Flip-Chip Package Molded Underfill Flip-Chip Package Lidded Flip-Chip Package Copper Pillar Bumping Power Device Package ~POL~ Sensing Edge Device Optical Chiplet/Co-Packaged Optics

Product【Glass-to-Metal Seals (GTMS)】required

Glass-to-Metal Seals (GTMS) for LD Device Glass-to-Metal Seals (GTMS) for LD Light Source CAN Package for High Speed Optical Communication Glass-to-Metal Seals (GTMS) for Initiator

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